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PCI Digitizer, VME TDC, PCI VME Master, Data Acquisition System

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  • M-Link

M-Link Data Interface

Contents

  1. M-Link Data Interface
    1. Highlights
    2. M-Link Network Card
    3. Mezzanine carrier card
    4. Characteristics
      1. Physical Layer
      2. Data Link Layer
      3. Host bus
    5. Specifications
    6. Software
M-Link is the ultra-high speed network interface.

Highlights

  • PCI-Express, 200 MB/s throughput
  • Fiber-optic and copper networks
  • FPGA implementation
  • Cost effective

M-Link Network Card

ccb-pcie-opt-angle2-thm.png

  • Multiple speed grades available: 800 Mbps, 1.6 Gbps, 2 Gbps. Media interface is LC duplex multimode 850nm fiberoptical optical connector.

The M-Link network cards use 8b/10b encoding with TLK2501 serdes chipset. Bidirectional flow control is implemented at hardware level.

M-Link network cards are available with PCI-Express interface.


ccb-pcie-thm.png

Mezzanine carrier card

M-Link mezzanine carrier is a PMC board with one 64-pin connector. It has duplex 16-bit data bus with speed 40..125 MHz, 2.5V CMOS signals. The connector is 64-pin AMP 120521-1 (receptacle), the daughter-boards have AMP 120527-1 plug. Mezzanine board size may vary from 75 mm x 110 mm to full size PCI 107 mm x 312 mm. The mezzanine assembly occupy one standard PCI slot. Component height spacing on mezzanine board is 10 mm top size and 2mm bottom size.

Characteristics

Physical Layer

  • Optical or copper media - network cards
  • 64-pin connector - mezzanine cards
  • Point-to-Point bidirectional links
  • 0.6 - 2.5 Gbps serial line speed
  • Hardware flow control
  • Hardware frame validation (CRC32)
  • Synchronization events for process control

Data Link Layer

  • Data is packed in frames with header, payload and CRC32
  • Frame sequence numbering for data integrity
  • 2028 bytes packet data payload

Host bus

  • PCI 32-bit 33MHz - 116 MB/s sustained throughput
  • PCI-Express 1x - 205 MB/s

Specifications

  • Physical, Electrical
    • M-Link Copper Interconnect Diagram

    • Mechanical data

    • Mezzanine connector signals

  • Link layer
    • Link Layer and Control Frame

  • Data layer
    • Data Layer: Data Frame

  • Application layer
    • Assigned Device ID list

Software

  • Linux packages


M-Link